1 n-channel 100 v (d-s) mosfet features ? halogen-free acc ording to iec 61249-2-21 definition ? extremely low q gd for sw itching losses ? 100 % r g test ed ? 100 % avalanche tested ? compliant to rohs directive 2002/95/ec applications ? p rimary side switch product summary v ds (v) r ds(on) ( )i d (a ) a q g (t yp.) 100 0. 045 at v gs = 10 v 9.7 23 nc 0 .047 at v gs = 8 v 7.5 so-8 sd sd sd gd 5 6 7 8 to p v ie w 2 3 4 1 n -channel mosfet g d s notes: a. base d on t c = 25 c . b. surface mounted on 1? x 1? fr4 board. c. t = 10 s. d. maximum under steady state conditions is 80 c/w. absolute maximum ratings (t a = 25 c, unless otherwise noted) pa rameter symbol limit unit drain-source voltage v ds 100 v gat e -source voltage v gs 20 contin uous d rain current (t j = 150 c ) t c = 25 c i d 9.7 a t c = 70 c 6.1 t a = 25 c 5.5 b, c t a = 70 c 4.5 b, c pulsed dr a in current i dm 50 contin uous sou rce-drain diode current t c = 25 c i s 4.5 t a = 25 c 2.6 b, c single pulse a v alanche current l = 0.1 mh i as 20 single pulse a v alanche energy e as 20 mj max i mum power dissipation t c = 25 c p d 5.9 w t c = 70 c 3.8 t a = 25 c 3.1 b, c t a = 70 c 2 b, c oper ating junction and storage temperature range t j , t stg - 55 to 150 c thermal resist ance ratings p aramet er symbol typical maximum unit maximum junction-to-ambient b, f t 10 s r thj a 33 40 c /w maximum junction-to-foot (drain) steady state r thjf 17 21 dt . www. daysemi.jp
2 note s: a. pulse test; pulse width 300 s, duty cycle 2 % a. guaranteed by design, not s ubject to production testing. stresses b eyond those listed under ?absolute maximum ratings? ma y cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. specif ications (t j = 2 5 c, unless otherwise noted) param eter symb ol test conditions min. typ. max. unit static drain-source breakdown v oltage v ds v gs = 0 v, i d = 25 0 a 100 v v ds temper ature coefficient v ds /t j i d = 250 a 172 mv/c v gs(t h) temperature co efficient v gs(t h) /t j - 10 gate-so urce thresho ld voltage v gs( t h) v ds = v gs , i d = 250 a 2.5 4 .5 v gate-source leakage i gss v ds = 0 v , v gs = 20 v 100 na z ero gate voltage drain current i dss v ds = 100 v, v gs = 0 v 1 a v ds = 100 v, v gs = 0 v, t j = 55 c 10 on-state dr ain current a i d( on ) v ds 10 v , v gs = 10 v 30 a drain-source on-state resistance a r ds(o n) v gs = 10 v, i d = 5 a 0.036 0.045 v gs = 8 v , i d = 5 a 0.0375 0.047 f orward transconductance a g fs v ds = 15 v , i d = 5 a 23 s dynami c b input capacita n ce c iss v ds = 50 v , v gs = 0 v , f = 1 mhz 1 735 pf output capacitance c oss 16 0 re v erse transfer capacitance c rss 37 to tal gate charge q g v ds = 75 v, v gs = 10 v, i d = 5 a 28.5 4 3 nc v ds = 75 v , v gs = 8 v , i d = 5 a 23 35 gate-s o urce charge q gs 8 gate- dr a in charge q gd 6.5 ga te re sistance r g f = 1 mhz 0.85 1.3 t urn-on delay time t d(on ) v dd = 50 v, r l = 10 i d ? 5 a, v gen = 10 v, r g = 1 14 21 ns rise time t r 12 18 t ur n-off delay time t d(of f) 22 33 fa l l time t f 610 tu r n - o n d e l ay t i m e t d(on) v dd = 50 v, r l = 10 i d ? 5 a, v gen = 8 v , r g = 1 16 24 rise time t r 12 18 tu r n-off delay time t d(of f) 20 30 fa l l time t f 712 drain- so urce body diode characteristics continuous source-drain diode current i s t c = 25 c 7.7 a pulse diode forward current a i sm 50 body diode vo ltage v sd i s = 2.6 a 0.77 1.2 v body diode reverse recovery time t rr i f = 5 a, di/dt = 100 a/s , t j = 25 c 63 95 ns body diode reverse recovery charge q rr 110 165 nc reverse recovery fall time t a 49 ns rev erse reco very rise time t b 14 dt . www. daysemi.jp
3 typica l c haracteristics (25 c, unless otherwise noted) outp ut charac teristics on-resistance vs. drain current and gate voltage gate charge 0 12 24 36 48 60 012345 v ds - drain-to-sou rce v oltage (v ) )a( tnerr u c niard -i d v = 10 v thru 7 v v = 6 v v = 5 v gs gs gs 0.035 0.039 0.043 0.047 0.051 0 . 0 55 0 1 02030405060 i d - drain cu rrent (a) v gs = 10 v r ) n o ( s d ( ) ecnatsiser-no - v gs = 8 v 0 2 4 6 8 10 0 6 12 1 8 24 30 i d = 5 a ) v ( egatlo v ecr u os-ot-etag - q g - t otal gate charge (nc) v sg v ds = 50 v v ds = 100 v v ds = 75 v t r ansfer characteristics capacitance on-resistance vs. junction temperature 0.0 0.3 0.6 0.9 1.2 02468 10 t c = 25 c t c = 125 c t c = - 55 c v gs - gate-to-sou rce v oltage (v ) )a( tnerr u c niard -i d c rss 0 400 800 1200 1600 2000 02 0 4060 8 0 100 c oss c is s v ds - drain-to-sou rce v oltage (v ) )fp( ecnaticapac - c 0.5 0.9 1.3 1.7 2.1 2.5 - 50 - 25 0 25 50 75 100 125 150 t j - ju nction t emperat u re (c) r )no(sd ecnatsiser-no - )dezilamro n ( v gs = 10 v i d = 5 a v gs = 8 v dt . www. daysemi.jp
4 ty pi cal characteristics (25 c, unless otherwise noted) source- drain diode forward voltage threshold voltage 0.1 0.01 0.001 v sd - sou rce-to-drain v oltage (v ) - (a) tnerr u c ecr u os i s 1.2 1 0.8 0.6 0.4 0.2 0 100 10 1 t j = 25 c t j = 150 c - 1.5 - 1.0 - 0.5 0.0 0.5 1.0 - 50 - 25 0 25 50 75 100 125 150 i d = 5 ma t j - t emperat u re ( c) v )ht(sg ) v ( on -resistance vs. gate-to-source voltage single pulse power, junction-to-ambient 0.00 0.04 0.08 0.12 0.16 0.20 02468 10 v gs - gate-to-sou rce v oltage (v ) r )no(sd ( ) ecnatsiser-no ecr u os-ot-niard- i d = 5 a = 125 c j t t j = 25 c 0 120 200 40 80 ) w ( re w op t ime (s) 160 11 0 0.1 0.01 0.001 safe operating area, ju nction-to-ambient * v gs minimu m v gs at w hich r ds ( on) is specified 100 0.01 10 )a( tnerr u c niard-i d 0.1 v ds - drain-to-so u rce v oltage (v ) 1 0.01 0.1 1 10 100 1000 t a = 25 c single pu lse 1 s 10 s dc 10 ms 100 ms 1 ms limited b y r ds ( on) * dt . www. daysemi.jp
5 typica l c haracteristics (25 c, unless otherwise noted) * t he po wer dissipation p d is based on t j( ma x) = 150 c, using junction-to-case thermal resi stance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. it is used to determine the current rating, when this rating falls below the package limit. current derating* 0 2 4 5 7 9 0 2 55075100125150 i d ) a( tnerr u c niard- t c - case t e mperat u re (c) powe r, junction-to-case 0.0 1.6 3.2 4.8 6.4 8.0 0 25 50 75 100 125 150 t c - case t emperat u re (c) power (w) powe r, junction-to-ambient 0.0 0.4 0.8 1.2 1.6 2 . 0 0 25 50 75 100 125 150 t a - amb ient t emperat u re (c) r (w )e w op dt . www. daysemi.jp
6 ty pi cal characteristics (25 c, unless otherwise noted) norm alized t hermal transient im pedance, junction-to-ambient 10 -3 10 -2 10 -1 100 squ are w a v e p u lse d u ration (s) 10 1000 1 0.1 0.01 tneisnart e v itceffe dezilamro n ecnadepmi lamreht 1 10 -4 1. duty cycle, d = 2. per unit base = r thja = 65 c/w 3. t jm - t a = p dm z thja (t) t 1 t 2 4. surface mounted notes: t 1 p dm t 2 0.2 0.1 0.05 0.02 single p u lse d u ty cycle = 0.5 no r malized thermal transient impedance, junction-to-foot 10 -3 10 1 0.1 0.01 squ are w a v e p u lse du ration (s) tneisnart e v itceffe dezilamro n ecnadepmi lamreht -4 10 0.2 0.05 single p u lse d u ty cycle = 0.5 0.02 10 -2 10 -1 1 dt . www. daysemi.jp
www. daysemi.jp 1 dim millimeters inch es min max min max a 1.35 1.7 5 0.053 0.069 a 1 0.10 0.2 0 0.00 4 0.008 b 0.35 0.51 0.014 0.020 c 0.19 0.25 0.0075 0.010 d 4.80 5.00 0.189 0.196 e 3.80 4.00 0.150 0.157 e 1.27 bsc 0.050 bsc h 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.020 l 0.50 0.93 0.020 0.037 q0 8 0 8 s 0.44 0.64 0.018 0.026 ecn: c-06527-rev. i, 11-sep-06 dwg: 5498 4 3 1 2 5 6 8 7 h e h x 45 c all le a d s q 0.101 mm 0.004" l ba 1 a e d 0.25 mm (g a ge pl a ne) s oic (narrow): 8-lead jedec p a rt n u m b er: m s -012 s package information
www .daysemi.jp 1 application note recommen ded minimum pads for so-8 0.246 (6.248) recommended mi nimum pads dimensions in inches/(mm) 0.172 (4.369) 0.152 (3.861) 0.047 (1.194) 0.028 (0.71 1) 0.050 (1.270) 0.022 (0.559) return to index r e turn to index application note
legal disclaimer notice www. daysemi.jp 1 disclaimer all product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. din-tek intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, din-tek ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. din-tek makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, din-tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain type s of applications are based on din-tek s knowledge of typical requirements that are often placed on din-tek products in generic applications. such statements are not binding statements about the suitability of products for a particular application. it is the customers responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify din-tek s terms and condit ions of purchase, including but not limited to the warranty expressed therein. except as expressly indicate d in writing, din-tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the din-tek product could result in personal injury or death. customers using or selling din-tek products not expressly indicated for use in such applications do so at their own risk. pleas e contact authorized din-tek personnel to ob tain written terms and conditions regarding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of din-tek . product names and markings noted herein may be trad emarks of their respective owners. material category policy din-tek intertechnology, inc. hereby certi fies that all its products that are id entified as rohs-compliant fulfill the definitions and restrictions defined under directive 2011/65/eu of the euro pean parliament and of the council of june 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (eee) - recast, unless otherwis e specified as non-compliant. please note that some din-tek documentation may still make reference to rohs directive 2002/95/ ec. we confirm that all the products identified as being compliant to directive 2002 /95/ec conform to directive 2011/65/eu. din-tek intertechnology, inc. hereby certifi es that all its products that are identified as ha logen-free follow halogen-free requirements as per jedec js709a stan dards. please note that some din-tek documentation may still make reference to the iec 61249-2-21 definition. we co nfirm that all the products identified as being compliant to iec 61249-2-21 conform to jedec js709a standards. legal disclaimer notice www.daysemi.jp revision: 02-oct-12 1 document number: 72610 disclaimer all product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. din-tek intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, din-tek ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. din-tek makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, din-tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain type s of applications are based on din-tek s knowledge of typical requirements that are often placed on din-tek products in generic applications. such statements are not binding statements about the suitability of products for a particular application. it is the customers responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify din-tek s terms and condit ions of purchase, including but not limited to the warranty expressed therein. except as expressly indicate d in writing, din-tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the din-tek product could result in personal injury or death. customers using or selling din-tek products not expressly indicated for use in such applications do so at their own risk. pleas e contact authorized din-tek personnel to ob tain written terms and conditions regarding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of din-tek . product names and markings noted herein may be trad emarks of their respective owners. material category policy din-tek intertechnology, inc. hereby certi fies that all its products that are id entified as rohs-compliant fulfill the definitions and restrictions defined under directive 2011/65/eu of the euro pean parliament and of the council of june 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (eee) - recast, unless otherwis e specified as non-compliant. please note that some din-tek documentation may still make reference to rohs directive 2002/95/ ec. we confirm that all the products identified as being compliant to directive 2002 /95/ec conform to directive 2011/65/eu. din-tek intertechnology, inc. hereby certifi es that all its products that are identified as ha logen-free follow halogen-free requirements as per jedec js709a stan dards. please note that some din-tek documentation may still make reference to the iec 61249-2-21 definition. we co nfirm that all the products identified as being compliant to iec 61249-2-21 conform to jedec js709a standards.
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